The Fraunhofer Institute for Reliability and Microintegration IZM specializes in industry-oriented applied research and helps companies to assembly robust and reliable electronic systems and integrate these into the application environment. As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research and focuces on packaging technology as well integration of multifunctional electronics into systems. The Institute has a staff of more than 377 and saw a turnover of 29.5 million Euros in 2016. The four Fraunhofer IZM departments jointly work on application areas and key development topics, ensuring the research is advanced across technologies. Fraunhofer IZM covers the entire spectrum of technologies and services necessary for developing reliable electronics and integrating new technology into applications. One of IZM’s core competences is development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting and sensors. Prototyping and hardware demonstrators are realized on basis of systematic simulation, customer specific design, and reliability and failure mechanisms investigations. This wide base serves the development of customer specific solutions and cutting-edge scientific development in photonic packaging and interconnection technologies leading to excellence in service provision.

Co-funded by the Horizon 2020

Famework Programe of the Euroepean Union